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Micrel
3.3V/5V DUAL LVTTL/LVCMOS-to-DIFFERENTIAL LVPECL TRANSLATOR
SY89322V Precision EdgeTM SY89322V
FEATURES
s s s s s s s s 3.3V and 5V power supply option 300ps typical propagation delay Differential LVPECL outputs PNP LVTTL inputs for minimal loading Flow-through pinouts Q outputs will default HIGH with inputs open Max. frequency range 800MHz Available in ultra-small 8-pin MLFTM (2mm x 2mm) package Precision EdgeTM
DESCRIPTION
The SY89322V is a dual TTL/CMOS-to-differential PECL translator capable of running from a 3.3V or 5V supply. This part can be used in either LVTTL/LVCMOS/LVPECL or TTL/CMOS/PECL systems. It requires only a single positive supply of +3.3V or +5V, no negative supply is required. The SY89322V is functionally equivalent to the SY100EPT22V, but in an ultra-small 8-lead MLFTM package that features a 70% smaller footprint. The ultra-small package and the low skew, dual gate design of the SY89322V makes it ideal for those applications where space, performance and low power are at a premium.
BLOCK DIAGRAM
Q0 INO /Q0
LVTTL
Q1 INI /Q1
LVPECL
Precision Edge is a trademark of Micrel, Inc. MicroLeadFrame and MLF are trademarks of Amkor Technology, Inc.
Rev.: A Amendment: /0
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Issue Date: August 2003
Micrel
SY89322V
PACKAGE/ORDERING INFORMATION
Ordering Information
Q0 /Q0 Q1 /Q1
1 2 8 7
VCC IN0 IN1 GND Part Number SY89322VMITR(Note 1)
Note 1. Tape and Reel.
Package Type MLF-8
Operating Range Industrial
Package Marking 322V
LVPECL
3 4
LVTTL
6 5
8-Pin MLFTM Ultra-Small Outline (2mm x 2mm)
PIN DESCRIPTION
Pin Number 1, 2, 3, 4 5 6, 7 8 Pin Name Q0, /Q0, Q1, /Q1 GND, Exposed Pad IN0, IN1 VCC Type 100k ECL Output Ground TTL/LVTTL Input Power Pin Function Differential LVPECL Outputs: Default to LOW if IN input left open. See
"Output Interface Applications" section for recommendations on terminations.
GND and exposed pad must be tied to ground plane. Single-ended TTL Inputs. Positive Power Supply: Bypass with 0.1F//0.01F low ESR capacitors.
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Micrel
SY89322V
Absolute Maximum Ratings(Note 1)
Supply Voltage (VCC) .................................. -0.5V to +6.0V Input Voltage (VIN) ......................................... -0.5V to VCC LVPECL Output Current (IOUT) Continuous ............................................................. 50mA Surge .................................................................... 100mA Input Current Source or sink current on IN, /IN .......................... 50mA Lead Temperature (soldering, 10 sec.) ................... +220C Storage Temperature (TS) ....................... -65C to +150C
Note 1.
Operating Ratings(Note 2)
Supply Voltage (VCC) .................................. +3.0V to +3.6V ............................................................ +4.5V to +5.5V Ambient Temperature (TA) ......................... -40C to +85C Package Thermal Resistance, Note 3 MLFTM (JA) Still-Air ................................................................. 93C/W 500lfpm ............................................................... 87C/W MLFTM (JB) Junction-to-Board ................................................ 60C/W
Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded. This is a stress rating only and functional operation is not implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to ABSOLUTE MAXIMUM RATlNG conditions for extended periods may affect device reliability. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the devices most negative potential on the PCB.
Note 2. Note 3.
DC ELECTRICAL CHARACTERISTICS
TA = -40C to +85C Symbol VCC ICC Parameter Power Supply Voltage Power Supply Current Condition Min 3.0 4.5 Typ Max 3.6 5.5 25 Units V V mA
TTL DC ELECTRICAL CHARACTERISTICS
VCC = +3.3V 10% or +5.0V 10%; TA = -40C to +85C, unless otherwise noted. Symbol VIH VIL IIH IIL VIK Parameter Input HIGH Voltage Input LOW Voltage Input HIGH Current Input LOW Current Input Clamp Voltage VIN = 2.7V VIN = VCC VIN = 0.5V IIN = -18mA Condition Min 2.0 0.8 20 100 -0.2 -1.2 Typ Max Units V V A A mA V
PECL DC ELECTRICAL CHARACTERISTICS
VCC = +3.3V 10% or +5V 10%; RL = 50 to VCC-2V; TA = -40C to +85C, unless otherwise noted. Symbol VOH VOL Parameter Output HIGH Output LOW Voltage Condition Min VCC-1.080 VCC-1.83 Typ Max VCC-0.880 VCC-1.550 Units V V
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Micrel
SY89322V
AC ELECTRICAL CHARACTERISTICS
VCC = +3.3V 10% or +5.0V 10%; RL = 50 to VCC - 2V, TA = -40C to +85C, unless otherwise noted. Symbol fMAX tPD tSKEW tJitter tr, tf
Note 4. Note 5. Note 6.
Parameter Maximum Toggle Frequency Propagation Delay Within-Device Skew Part-to-Part Jitter Cycle-to-Cycle Jitter Total Jitter Output Rise/Fall Time (20% to 80%)
Same transition at common VCC levels.
Condition
Min
Typ
Max 800
Units MHz ps ps ps ps(rms) ps(pk-pk) ps
IN-to-Q Note 4 Note 4 Note 5 Note 6
100
600 100 500 2 25
200
500
Cycle-to-cycle jitter definition: The variation of periods between adjacent cycles, Tn - Tn-1,where T is the time between rising edges of the output signal. Total jitter definition: with an ideal clock input of frequency fMAX, no more than one output edge in 1012 output edge will deviate by more than the specified peak-to-peak jitter value.
LVPECL OUTPUT INTERFACE APPLICATIONS
VCC
VCC
R1 ZO = 50 ZO = 50 VCC --2V R2
VCC = 3.3V; R1 = 130, R2 = 82 VCC = 5V; R1 = 83, R2 = 125
R1
VCC
VCC
ZO = 50 ZO = 50 50 50 Rpd
VCC
R2
VCC = 3.3V; Rpd = 50 VCC = 5V; Rpd = 100
VCC --2V
C (Optional) 0.01F
Figure 1a. Parallel TheveninEquivalent Termination
Figure 1b. Three Resistor "Y Termination"
VCC VCC VCC R1 R1 ZO = 50 VCC --2V R3 VCC
R2
R2
R4 VCC --1.3V
VCC = 3.3V; R1 = 130, R2 = 82, R3 = 1k, R4 = 1.6k, VCC = 5V; R1 = 83, R2 = 125, R3 = 1k, R4 = 2.8k,
Figure 1c. Terminating Unused I/O
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Micrel
SY89322V
8 LEAD ULTRA-SMALL EPAD-MicroLeadFrameTM (MLF-8)
Package EP- Exposed Pad
Die
CompSide Island
Heat Dissipation Heat Dissipation VEE Heavy Copper Plane VEE Heavy Copper Plane
PCB Thermal Consideration for 8-Pin MLFTM Package Package Notes: Note 1. Package meets Level 2 qualification. Note 2. All parts are dry-packaged before shipment. Note 3. Exposed pads must be soldered to a ground for proper thermal management.
MICREL, INC.
TEL
1849 FORTUNE DRIVE SAN JOSE, CA 95131
FAX
USA
+ 1 (408) 944-0800
+ 1 (408) 944-0970
WEB
http://www.micrel.com
The information furnished by Micrel in this datasheet is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for its use. Micrel reserves the right to change circuitry and specifications at any time without notification to the customer. Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product can reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant into the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. A Purchaser's use or sale of Micrel Products for use in life support appliances, devices or systems is at Purchaser's own risk and Purchaser agrees to fully indemnify Micrel for any damages resulting from such use or sale. (c) 2003 Micrel, Incorporated.
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